| Mfg Part Number: BAS16 | Manufacturer: Philips Circuit Assemblies | NSN : 5961-01-352-3496 |
| NIIN : 013523496 | Item Name : semiconductor devic | CAGE Code : 25403 |
| FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for choosing to source your item - BAS16 Semiconductor Devic under FSC 5961 Semiconductor Devices and Associated Hardware from Single Source Aero! We are a leading distributor of premium NSN parts from reliable manufacturers, such as Philips Circuit Assemblies. As an ASAP Semiconductor owned and operated purchasing platform, quality is the cornerstone of our operations, so you can rely on us to provide only the highest caliber parts for your projects. We offer as much information as possible on all products in our inventory, including this BAS16 Semiconductor Devic by Philips Circuit Assemblies item, which is listed alongside the NSN 5961-01-352-3496. Additionally, all products are shipped to you alongside their qualifying certifications and manufacturing trace documentation, as applicable.
Kick off the parts procurement process today by completing a Request for Quote form for any item. With our Instant Quote service, a dedicated representative will contact you within 15 minutes or less to offer a custom quotation that fits your needs. We only ask that you include as much detail as possible, such as time constraints and desired quantities, because this allows our market experts to better tailor your quote. We currently have NSN Part Number BAS16 in stock and ready for purchase from Philips Circuit Assemblies, listed alongside the CAGE code 25403, so submit an RFQ today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-352-3496 Item Description: Semiconductor Devic | 5961 | 013523496 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Bas16 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| ABHP | OVERALL LENGTH | 0.110 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.029 INCHES MINIMUM AND 0.037 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.047 INCHES MINIMUM AND 0.055 INCHES MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-23 |
| ASKA | COMPONENT NAME AND QUANTITY | 3 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 75.0 MAXIMUM BREAKDOWN VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE |
| FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| ABJT | TERMINAL LENGTH | 0.018 INCHES MINIMUM AND 0.024 INCHES MAXIMUM |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 250.00 MILLIAMPERES FORWARD CURRENT, AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE |
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